- No Clean Flux
- Easily Dispensed
- Excellent Wettability
- Ideal for surface mount applications
M.G. Chemicals Leaded, No Clean Solder Paste is made from a blend of virgin high purity non-recycled Tin and Lead metal powder blended with a No Clean flux to form a paste. Designed for surface mount applications using a syringe dispensing method, it provides high tack force and good wettability. The post soldering transparent residues are non-conductive, non-corrosive and highly insulated. The name no clean refers to the fact that the flux residues are not harmful to assemblies and does not mean there will be no residues.